Finite Element Analysis (FEA) is commonly employed to assess the reliability of solder joints subjected to temperature cycling. To achieve accurate results, an appropriate viscoplastic law is essential for modeling the thermomechanical behavior of the solder alloy. Among the available models, the Anand viscoplastic model has been extensively utilized for FEA simulations of SAC305 solder joints. Consequently, numerous studies have focused on determining its nine parameters [1-

Electronic equipment used in the field can be exposed to harsh conditions such as thermal cycling, vibration, drop, shock, and static loading, which may lead to failure. Using Finite Element Analysis (FEA), we provide advanced solutions to evaluate and enhance the reliability of your products under severe conditions. Feel free to contact us with any questions or inquiries about your projects!

Electronic assemblies exposed to severe thermal environments can fail due to thermomechanical fatigue of solder joints. During temperature cycling, solder joints experience shear strains caused by the Coefficient of Thermal Expansion (CTE) mismatch between the component and the PCB: Solder joints subjected to shear loading during temperature cycles due to CTE mismatch between the PCB and the component Accurately assessing the CTE of both the PCB and the component is crucial f

Participation au séminaire « Réparation & Circularité de l’électronique » organisé par We Network. Des échanges riches qui illustrent les dynamiques actuelles autour des enjeux de réparation, de circularité et de transformation de la filière électronique. Chez Hooke Electronics, l’expertise en fiabilité des assemblages électroniques constitue un maillon essentiel de cet écosystème, contribuant à prolonger la durée de vie et à sécuriser les équipements dans les chaînes circula

Electronic equipment used in the field is often exposed to harsh vibration loading, which can lead to the failure of electronic assemblies due to high-cycle fatigue of the solder interconnects. For Surface Mount Technology (SMT) components, the out-of-plane displacement of the circuit board induces the highest stresses in the solder joints. Furthermore, the vibrations experienced can be either sinusoidal or random in nature: Examples of sinusoidal and random vibration signal

The study from Hooke Electronics, “Physics-of-Failure-Based Reliability Modeling of Lead-Free Electronic Assemblies Under Thermal Cycling,” was presented at the Electronics Manufacturing & Packaging Symposium held at the European Space Agency – ESA / European Space Research and Technology Centre (ESTEC), in partnership with the Global Electronics Association. The event provided an excellent opportunity to exchange ideas on the reliability of electronic assemblies for space ap

The study, "Thermal Cycling Durability Model for Lead-Free Wafer Level Packages," was presented at the International Microelectronics Assembly and Packaging Society (IMAPS) MiNaPAD 2026 conference. The conference provided an excellent opportunity to share this work and engage in discussions on improving the reliability of Wafer Level Packages. Sincere thanks to the organizers for hosting such a well-organized and inspiring event, and to all the participants for the insightful

Hooke Electronics was honored to present the study entitled, 'A New Efficient and Easy-to-Use Thermomechanical Reliability Model for...

Hooke Electronics is delighted to announce its membership in the Centre Français de Fiabilité! This collaboration will enable us to...

Embedded electronic equipment can operate in severe thermal environments that can damage solder joints. During temperature cycles, the...

Explore the impact of temperature cycles on the microstructure of solder alloys and on the overall reliability of electronic assemblies