Highlights from IMAPS MiNaPAD 2026: Thermal Cycling Durability of Lead-Free Wafer Level Packages

The study, "Thermal Cycling Durability Model for Lead-Free Wafer Level Packages," was presented at the International Microelectronics Assembly and Packaging Society (IMAPS) MiNaPAD 2026 conference.

The conference provided an excellent opportunity to share this work and engage in discussions on improving the reliability of Wafer Level Packages.

Sincere thanks to the organizers for hosting such a well-organized and inspiring event, and to all the participants for the insightful discussions and valuable exchanges.