hookeelectronics

Finite Element Analysis (FEA) is commonly employed to assess the reliability of solder joints subjected to temperature cycling. To achieve accurate results, an appropriate viscoplastic law is essential for modeling the thermomechanical behavior of the solder alloy. Among the available models, the Anand viscoplastic model has been extensively utilized for FEA simulations of SAC305 solder joints. Consequently, numerous studies have focused on determining its nine parameters [1-4]: SAC305 Anand...

Electronic equipment used in the field can be exposed to harsh conditions such as thermal cycling, vibration, drop, shock, and static loading, which may lead to failure. Using Finite Element Analysis (FEA), we provide advanced solutions to evaluate and enhance the reliability of your products under severe conditions. Feel free to contact us with any questions or inquiries about your projects!

Electronic assemblies exposed to severe thermal environments can fail due to thermomechanical fatigue of solder joints. During temperature cycling, solder joints experience shear strains caused by the Coefficient of Thermal Expansion (CTE) mismatch between the component and the PCB: Solder joints subjected to shear loading during temperature cycles due to CTE mismatch between the PCB and the component Accurately assessing the CTE of both the PCB and the component is crucial for evaluating the...