Presenting at EMPS 2025: Reliability Modeling of Lead-Free Electronic Assemblies Under Thermal Cycling

The study from Hooke Electronics, “Physics-of-Failure-Based Reliability Modeling of Lead-Free Electronic Assemblies Under Thermal Cycling,” was presented at the Electronics Manufacturing & Packaging Symposium held at the European Space Agency – ESA / European Space Research and Technology Centre (ESTEC), in partnership with the Global Electronics Association.

The event provided an excellent opportunity to exchange ideas on the reliability of electronic assemblies for space applications and the transition toward lead-free technologies.

Many thanks to the organizers for a highly inspiring and well-organized event, and to all participants for the engaging discussions.