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Personalized consulting services

Whether you are in the early stages of design or well into the development process, it is essential to ensure that your electronic equipment meets the required performance throughout its lifecycle. With our expertise in material science, mechanical engineering, and extensive industry knowledge in both experimental work and modeling techniques, we can assist you in various aspects of electronic reliability.

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Designing tailored reliability programs 

  • Design of test vehicles (PCB stack-up, components selection, soldering process, etc.)

  • Solder material characterization (stress-strain curves, creep / stress relaxation, thermomechanical hysteresis loop)

  • Choice of the accelerated tests (thermal cycling, vibrations, shocks, 3-point / 4-point bending, etc.)

  • Experimental setup (thermal chambers, electrodynamic shaker, measurement equipment, etc.)

  • Statistical analysis of the test results

  • Help regarding failure analysis

  • Numerical modelling for solder joints fatigue models

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Assessing and improving the reliability of your electronic equipment

  • Lifetime evaluation of lead-free and tin-lead electronic assemblies subjected to temperature cycling

  • Evaluation of the vibration and shock reliability of lead-free and tin-lead electronic assemblies

  • Evaluation of the resistance of lead-free and tin-lead electronic assemblies to static loading

  • Optimization of your design and proposal of robustification solutions to increase the lifetime of your electronic equipment  

  • Assessment of the resistance of electronic equipment to climatic environments (temperature and pressure variations, humidity,  condensation, dew point, freeze / thaw, long-term storage)

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Performing Finite Element Analysis (FEA) simulations

  • Thermomechanical analysis

  • Modal analysis

  • Harmonic and random vibration analysis

  • Static analysis

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Analyzing material characterization tests

  • Stress-strain relationships

  • Creep / stress relaxation tests

  • 3-point / 4-point bending tests

  • Nanoindentation tests

  • Thermo-Mechanical Analysis (TMA)

  • Dynamic Mechanical Analysis (DMA)

  • Topography and Deformation Measurement (TDM) 

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Ensuring effective knowledge management

  • Comprehensive literature reviews

  • Capitalization reports on key topics

  • Didactic presentations translating technical aspects for broader understanding

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