The objective of this training program is to explain a step-by-step methodology for assessing the physical properties of complex Printed Circuit Boards (PCBs), from glass-epoxy laminates and prepregs to multilayer stackups. Knowledge of these properties is essential for conducting accurate reliability evaluations of complete electronic boards.

• Introduction

• Fabrication of laminates and prepregs

• Physical properties of the constituent materials (epoxy resin, glass fiber fabrics, copper)

• Definition of the Representative Volume Element (RVE)

• Models to assess the physical properties of laminates and prepregs

• Comparison with experimental results

• Fabrication of PCBs

• Definition of the Representative Copper Layer (RCL)

• Models to assess the physical properties of multilayer PCB stackups

• Comparison with experimental results

• Questions / Answers

Basic knowledge of PCBs and material science.

Professionals in technical roles seeking an introductory understanding of solder joint reliability.

Electronic Assembly Expert.

Quiz at the end of the training session.

Powerpoint presentation with video materials and case studies.