The objective of this training program is to provide a complete and comprehensive overview of lead-free electronics reliability under temperature cycling and vibration / shock, from understanding microstructural phenomena at the microscopic level to developing reliability models based on experimental durability testing and the analytical and numerical evaluation of fatigue metrics.

• Introduction

• What is lead-free electronics?

• Lead-free solder alloy compositions

• Microstructure of lead-free solder joints

• Materials properties

• Experimental testing methods

  • Temperature cycling

  • Vibration / shock

• Acceleration Factors

• Reliability modeling

  • Analytical models

  • Finite Element Analysis (FEA)

• Statistical analysis of durability data

• Questions / Answers

Basic knowledge of materials science, electronic assemblies, component technologies, and statistical analysis.

Professionals in technical roles seeking an introductory understanding of solder joint reliability.

Electronic Assembly Expert.

Quiz at the end of the training session.

Powerpoint presentation with video materials and case studies.