Duration
0.5 day
Prices
Available upon request
Location
Online or on-site
Languages
English and French
The basics of solder joint reliability
Objectives
The objective of this training program is to provide fundamental knowledge on assessing solder joint reliability, from understanding the material properties of electronic assembly elements to calculating the reliability of a complete electronic board.
Program
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Introduction
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Overview of Printed Circuit Board Assembly (PCBA)
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Material properties of PCBA elements (PCB, solder alloy, components)
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Product life cycle
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Durability testing methods
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Reliability modeling
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Statistical analysis techniques
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Questions / Answers
Pre-requisites
Basic knowledge of materials science and statistical analysis.
Target audience
Professionals in technical roles seeking an introductory understanding of solder joint reliability.
Instructor
Electronic Assembly Expert.
Evaluation
Quiz at the end of the training session.
Training methods
Powerpoint presentation with video materials and case studies.