Software

Our reliability assessment software is currently under development, it will allow you to calculate the lifetime of your electronic assemblies subjected to temperature cycles, helping you prevent failures throughout their life cycles. The underlying reliability model has been derived from more than 110 experimental data obtained with different Printed Circuit Board stack-ups, thermal cycling conditions and electronic components:

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• Resistors / capacitors,

• Leadless Chip Carrier (LCC),

• Ball Grid Array packages (BGA),

• Chip Scale Packages (CSP)

• Wafer Level Packages (WLP),

• Quad Flat No-Lead packages (QFN)

Unlike most reliability models which are component-dependent, our model is universal and can be used for any of these types of components, provided the material properties and the solder joints shape can be assessed.

While the software is still under development, the model is ready to use! Feel free to contact us if you have any inquiries.