HookeXpert Software

Our thermomechanical reliability assessment software allows you to calculate the lifetime of your electronic assemblies subjected to temperature cycles, helping you prevent failures throughout their life cycles. The underlying reliability model has been derived from more than 110 experimental data obtained with different Printed Circuit Board stack-ups, thermal cycling conditions and electronic components:

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• Resistors / capacitors,

• Leadless Chip Carrier (LCC),

• Ball Grid Array packages (BGA),

• Chip Scale Packages (CSP)

• Wafer Level Packages (WLP),

• Quad Flat No-Lead packages (QFN)

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While the software is still in its beta version, the model is fully operational and ready to use. Feel free to contact us if you have any questions.